Memories
Find more about our Reliability, Burn-in and Testing solutions for Memories.
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ETNA VBTS-M
The ETNA VBTS-M is our Burn-in and Reliability Equipment focused on SoC, Analog, Digital & Mixed Signal, Microprocessors, MEMS, Memories and High Power devices.
Published in: Burn-in & Reliability Equipment -
ERIS Thermal Platform
The ERIS equipment is our single-chamber solution, which can be factory-configured to run Hot&Cold, THB, H3TRB, HTRB and DH3TRB tests, resulting in different thermal and environmental system specification.
Published in: Burn-in & Reliability Equipment -
QM48 VBTS-M
The QM48 VBTS-M solution is our Burn-in equipment designed for many typologies of devices, such as SoC, Analog & Digital, Microprocessors, MEMS, Memories and High Power. The system is equipped with 4 independent…
Published in: Burn-in & Reliability Equipment -
VBTS-M Test Platform
The VBTS-M is our Universal and Modular Burn-in & Reliability Test Platform, designed for different types of devices, such as Microprocessors, Analog, Digital & Mixed Signal, MEMS and Memories. This product is…
Published in: Test Electronics -
PBTS
PBTS stays for Pre-Burn-in Test Station and it is meant to be used for Burn-in Boards verification before the Burn-in.
Published in: Test Stations -
ETS
ETS stays for Engineering Test Station and it is meant to be used for activities like Application Development, Burn-in Boards design debug and Test program verification.
Published in: Test Stations -
EDA Burn-in Boards
In addition to the following Burn-in Boards portfolio, we are specialized in meeting specific customer requests, by customizing our solutions or by designing new ones.
Published in: Burn-in Boards -
EDA Operating System Software
The EDA Operating System Software, available with the same characteristics both for Wafer and Package Level, provides the complete set of tools for Test Development (SW Development package), Production execution and Reporting…
Published in: Software Platforms & Data Analysis Tool -
EDA Thule
The EDA Thule is our powerful and multipurpose Data Analysis Software, which can be embedded in both EDA Wafer and Package Level Equipment.
Published in: Software Platforms & Data Analysis Tool