Last June 11 we had the honor to make a successful presentation at the Exhibitor Stage of PCIM Europe 2024.

Speakers of the day were the Technical Director Alessandro Polpetta and the Business Development Manager Andrea Lucaroni, who introduced our company and shared the most important stress and test features recently integrated into our package and wafer-level solutions for the static and dynamic characterization of WBG Devices.

Special thanks to all of you that came to hall 9-642 of Nürnberg Messe to learn more about our products and services!